Remuneration
A highly competitive remuneration package will be offered. Applicants should state their current and expected salary in the application.
Project Description
While the rapidly advancing haptics technologies in wearable devices and surface haptic devices have enabled many exciting applications in virtual reality (VR), augmented reality (AR), telecommunication, and teleoperation, they still suffer from issues in bulkiness, comfortability, and consistency. The solutions to these issues lie in the fundamental understanding of the multi-physics interactions in the human-machine interface, which include contact deformation, capillary formation, electric field, heat transfer, material non-linearity, and their complicated coupling effects.
1. Wearable sensor and actuator array for human-machine interactions
2. Friction modulated surface haptics devices
3. Biomimetic evaluation system for haptic actuators
Qualification
Motivated applicants with Bachelor's or Master's degrees in Mechanical Engineering, Electrical Engineering and other related fields are welcome to apply. Solid knowledge in mechanics is considered favorably. Experience and knowledge in control, Labview, manufacturing, and finite element analysis are also a plus.
About the PI
Dr. Yuan Ma received his bachelor's and M.S. degrees in mechanical engineering and materials science from Tsinghua University, Beijing in 2011 and 2013, respectively. He received his Ph.D. degree in mechanical engineering from the University of California, Berkeley in 2018. Prior to joining the Hong Kong Polytechnic University in 2021, he worked as a postdoctoral researcher in Texas A&M University. His research interest includes micro/nano scale mechanical and tribological behaviour of human-machine interfaces, haptics metamaterials development, wearable devices with piezoelectret materials, and application of artificial intelligence in human-machine interactions. He has authored 12 peer-reviewed journal papers in Advanced Materials, ACS Nano, Advanced Functional Materials, ACS Applied Materials and Interfaces, Applied Physics Letters, IEEE Transaction on Haptics, and IEEE Transaction on Magnetics.